CHEMICAL/MECHANICAL POLISHING DEVICE FOR WAFER AND WAFER POLISHING METHOD USING SAME

• Main Authors: KIDA HIROAKI, TAKAOKA KAZUHIRO
• Format: Patent
• Language: English
• Published: 19.10.1999
• Edition: 6
• Subjects: BASIC ELECTRIC ELEMENTS; DRESSING OR CONDITIONING OF ABRADING SURFACES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; PERFORMING OPERATIONS; POLISHING; SEMICONDUCTOR DEVICES; TRANSPORTING

PROBLEM TO BE SOLVED: To make a wafer surface flat by providing a washing water supply mechanism capable of supplying washing water to a surface of suction pad, and a supply nozzle capable of blowing pressured gas to the surface thereof. SOLUTION: A wafer suction surface of a suction pad 4 of a chuc...