CHEMICAL/MECHANICAL POLISHING DEVICE FOR WAFER AND WAFER POLISHING METHOD USING SAME

PROBLEM TO BE SOLVED: To make a wafer surface flat by providing a washing water supply mechanism capable of supplying washing water to a surface of suction pad, and a supply nozzle capable of blowing pressured gas to the surface thereof. SOLUTION: A wafer suction surface of a suction pad 4 of a chuc...

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Bibliographic Details
Main Authors KIDA HIROAKI, TAKAOKA KAZUHIRO
Format Patent
LanguageEnglish
Published 19.10.1999
Edition6
Subjects
BASIC ELECTRIC ELEMENTS
DRESSING OR CONDITIONING OF ABRADING SURFACES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
SEMICONDUCTOR DEVICES
TRANSPORTING
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Summary:PROBLEM TO BE SOLVED: To make a wafer surface flat by providing a washing water supply mechanism capable of supplying washing water to a surface of suction pad, and a supply nozzle capable of blowing pressured gas to the surface thereof. SOLUTION: A wafer suction surface of a suction pad 4 of a chuck mechanism A is washed with washing solution fed for about 20-60 sec. from a washing solution mechanism 14, and if required the surface is scrubbed with a washing brush 16 while spraying the solution thereto. Then, pressure gas of about 1-5kg/cm is jetted to a center of the pad 4 from a gas supply nozzle 15 for about 20-90 sec. to dry it. Thereafter, a wafer on a tentative receiving base is sucked to the pad 4, transferred and lowered, then pushed against a polishing cloth 12 on a polishing table 11, and subjected to a primary polishing with the polishing solution supplied onto the polishing cloth 12.
Bibliography:Application Number: JP19980107172