INTERNAL SURFACE GRINDING METHOD

PROBLEM TO BE SOLVED: To enhance circularity. SOLUTION: The inner circumferential surface Wa of each straight hole Ha formed in a work W is ground by a grinding wheel T while both the work W and the grinding wheel T are being rotated. In this case, its inner circumferential surface Wb is roughly gro...

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Bibliographic Details
Main Authors KANEYASU SHUSAKU, KURATA KATSUHIRO, TAKAMURA SEIZO
Format Patent
LanguageEnglish
Published 12.10.1999
Edition6
Subjects
DRESSING OR CONDITIONING OF ABRADING SURFACES
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
TRANSPORTING
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Abstract PROBLEM TO BE SOLVED: To enhance circularity. SOLUTION: The inner circumferential surface Wa of each straight hole Ha formed in a work W is ground by a grinding wheel T while both the work W and the grinding wheel T are being rotated. In this case, its inner circumferential surface Wb is roughly ground so as to be finished in grinding by applying cut-feeding thereto while the grinding tool T is reciprocated to the axial direction of the straight hole Ha. And when finishing grinding is over, both cut- feeding and reciprocating motion in the axial direction of the grinding wheel T are suspended, and spark-out grinding is then applied thereto.
AbstractList PROBLEM TO BE SOLVED: To enhance circularity. SOLUTION: The inner circumferential surface Wa of each straight hole Ha formed in a work W is ground by a grinding wheel T while both the work W and the grinding wheel T are being rotated. In this case, its inner circumferential surface Wb is roughly ground so as to be finished in grinding by applying cut-feeding thereto while the grinding tool T is reciprocated to the axial direction of the straight hole Ha. And when finishing grinding is over, both cut- feeding and reciprocating motion in the axial direction of the grinding wheel T are suspended, and spark-out grinding is then applied thereto.
Author KANEYASU SHUSAKU
KURATA KATSUHIRO
TAKAMURA SEIZO
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Snippet PROBLEM TO BE SOLVED: To enhance circularity. SOLUTION: The inner circumferential surface Wa of each straight hole Ha formed in a work W is ground by a...
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SubjectTerms DRESSING OR CONDITIONING OF ABRADING SURFACES
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
TRANSPORTING
Title INTERNAL SURFACE GRINDING METHOD
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