SEMICONDUCTOR DEVICE WITH METAL REINFORCING MATERIAL

• Main Authors: HOSOKAWA YOICHI, IIOKA SHINJI, NOMURA YOSHIHIRO, YAMAMOTO KAZUNORI
• Format: Patent
• Language: English
• Published: 28.09.1999
• Edition: 6
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; BASIC ELECTRIC ELEMENTS; CHEMISTRY; COMPOSITIONS BASED THEREON; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; POLISHES; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF MATERIALS AS ADHESIVES

PROBLEM TO BE SOLVED: To enable a semiconductor device with a metal reinforcing material to deteriorate less even in a humidity test under strict conditions, by a method wherein the storage elastic modulus of an adhesive agent layer which is provided between the metal reinforcing material and an org...