ELECTRONIC PART

PROBLEM TO BE SOLVED: To obtain an electronic part in which electric short circuit is prevented even in the case of fine pattern connection pitch by an arrangement wherein a metal layer for preventing diffusion of solder comprises a solder bump electrode, a wet region and an unwet region and the cen...

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Main Authors HIGUCHI KAZUTO, TATEYAMA KAZUKI, TAKAGI AYAKO, YAMADA HIROSHI, TOGASAKI TAKASHI, MIYAGI TAKESHI
Format Patent
LanguageEnglish
Published 04.11.1998
Edition6
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To obtain an electronic part in which electric short circuit is prevented even in the case of fine pattern connection pitch by an arrangement wherein a metal layer for preventing diffusion of solder comprises a solder bump electrode, a wet region and an unwet region and the central part for at least an opening region comprises a solder bump electrode and a wet region. SOLUTION: An electrode pad 13 is provided on an electronic part 11 comprising a silicon semiconductor and an insulating protective film 12 of silicon nitride is deposited thereon. A first metal layer 14 of titanium for preventing diffusion of solder is formed along the surface of the electrode pad 13 at an opening 18 and the insulating protective film 12 while covering them perfectly and a second metal layer 15 of nickel for preventing diffusion of solder is formed thereon. A solder bump electrode 17 is formed on the second metal layer 15 for preventing diffusion of solder. Since titanium is not wetted but nickel is wetted with molten solder, the solder bump electrode is formed only on the second metal layer for preventing diffusion of solder.
Bibliography:Application Number: JP19970101740