ELECTRODE STRUCTURE OF SIDE SURFACE TYPE ELECTRONIC COMPONENT AND MANUFACTURE THEREOF

• Main Author: ISHII HIROHIKO
• Format: Patent
• Language: English
• Published: 21.08.1998
• Edition: 6
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide the electrode structure wherein a side surface type electronic component is reliably mounted and fixed on a printed board, of the side surface type electronic component, which is superior in productivity, economical efficiency and reliability, and a method of manufacturing the electronic component. SOLUTION: Recess parts are formed at constant intervals in a multichip aggregate insulating board at positions opposing to long hole-shaped through holes, which are formed in a plurality of rows at prescribed intervals in the insulating board, a copper-plated layer is formed on the whole surface of the insulating board including the inner surfaces of the through holes by a plating treatment, a plating resist is laminated on the copper-plated layer and after the board is exposed and developed, a pattern mask is formed, a pattern-etching is performed on the board, an upper surface electrode 2 and a lower surface electrode 3 are formed on the board and side surface electrodes 4 are formed on the surfaces of the through holes including the recess parts 4a to link together continuously the electrodes 2, 4 and 3. After an electronic element 5 is mounted on the electrode 2, the, element 5 is resin- sealed with a sealing resin 7. The insulating board is cut along cut lines, which pass through the long hole-shaped through holes and the recessed parts, to split the board into a single piece of a side surface type electronic component 20. The soldering area of the component 20 is spread due to the recess parts 4a, the fixing force of solder with the board is increased and the reliability of the component 20 is enhanced.