MOUNTING STRUCTURE FOR LIGHT EMITTING DIODE

• Main Author: ISHIGURO SHIGEYUKI
• Format: Patent
• Language: English
• Published: 16.01.1998
• Edition: 6
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a highly reliable mounting structure in which the intensity of light can be increased by collecting the light emitted from a light emitting section well while dissipating heat well therefrom. SOLUTION: A light emitting diode(LED) 1 having a p-n interface is inclined on the rear side face thereof similarly to the conical recessed side face (reflective wall 2) of a stem 15. Recessed bottom face of the stem 15 has same area as the rear surface of the LED chip 1. Consequently, the opening end of the recess can be reduced as compared with a case where the recessed bottom face has a wide area and thereby the light collecting properties can be enhanced. The LED 1 is bonded to the stem 15 through a conductive adhesive 3 and mounted. Since the LED 1 touches the stem 15 not only on the rear surface thereof but also on a part of the side face thereof through the conductive adhesive 3, heat dissipation from the emitting part of the LED 1 is enhanced. Excess adhesive 3 is stored in the groove or hole 11 made in the side face of the stem 15 and the adhesive 3 does not creep up to the p-n interface of the LED 1 at the time of mounting.