SOLDER-FEEDING METHOD

• Main Authors: KAGA YASUHISA, IRIE HISAO
• Format: Patent
• Language: English
• Published: 24.04.1998
• Edition: 6
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CURRENT COLLECTORS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LINE CONNECTORS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

PROBLEM TO BE SOLVED: To provide a solder-feeding method with which sufficiently high bumps can be formed, without having irregularities in the bridge between the bumps and the size of the bridge. SOLUTION: In this solder feeding method, a solder composition 14 is fed to the conductive part 12 and its neighborhood of a good heat conductive substrate 11 having the conductive part 12, and a solder layer is formed on the conductive part 12 by heating the solder composition 14. In this case, a process in which a low heat conductivity layer 13, having the heat conductivity lower than the conductive part 12 and the good heat conductive substrate 11 is formed, and a process in which the solder composition 14 is fed to the conductive part 12 and its neighborhood, a process in which the degree of activity of the solder composition 14, in the vicinity of the conductive part 12 is enhanced with respect to the degree of activity of the solder composition 14 in the vicinity of the low heat conductivity layer 13 by heating the good conductivity substrate 11. The solder composition 14 is brought into a molten state by heating, a process in which the good heat conductivity substrate 11 is cooled, and a process in which the good heat conductivity substrate 11 is washed, is conducted.