STRUCTURE AND METHOD FOR SEALING ELECTRONIC ELEMENT

• Main Authors: FUJINO SHUICHI, KANEMOTO MANABU, SUGIHARA TADASHI, MIZUGUCHI AKIO
• Format: Patent
• Language: English
• Published: 24.12.1996
• Edition: 6
• Subjects: BASIC ELECTRIC ELEMENTS; CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE; ELECTRICITY; MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES; MICROSTRUCTURAL TECHNOLOGY; PERFORMING OPERATIONS; PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS; PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSIONOF CHEMICAL INTO ELECTRICAL ENERGY; TRANSPORTING

PURPOSE: To provide a structure and a method for sealing an electronic element which allows an inner space to be used effectively while meeting the demands for reduction in size and thickness. CONSTITUTION: A package 2 is made by joining metal terminal plates 22 for sealing openings of both sides of an outer frame 21 and the insulating ring- shaped outer frame 21 through brazing material 23. In this case, it is preferred that the ring-shaped outer frame 21 should be made of alumina and the metal terminal plates 22 should be made of nickel or nickel alloy. This sealing structure is very suitable for sealing an electric double layer capacitor inside. As for a method for manufacturing the case 2, the metal terminal plates 22 and the outer frame 21 are united by applying laser to the brazing material 23 interposed between then so that they may close the openings of the outer frame 21.