INTEGRATED CIRCUIT

PROBLEM TO BE SOLVED: To provide an integrated circuit provided with an inexpensive coating fuse link and an exposure connection pad. SOLUTION: A fuse link 16 is formed of a part of the upper end level of patterned metal in an integrated circuit 10. The layer to which an oxide material 26 is adhered...

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Bibliographic Details
Main Authors ASHIGAKI SHIGEO, FUKUHARA HIDEYUKI
Format Patent
LanguageEnglish
Published 18.10.1996
Edition6
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide an integrated circuit provided with an inexpensive coating fuse link and an exposure connection pad. SOLUTION: A fuse link 16 is formed of a part of the upper end level of patterned metal in an integrated circuit 10. The layer to which an oxide material 26 is adhered covers the fuse link. A laser beam 36 is applied through the oxide material 26, it heats and opens the fuse link 16. The adhered protection oxide and the layer of PIX coat the fuse link and the layer of the oxide material. One photograph processing process is avoided by positioning the fuse link 16 and a connection pad 22, which are generated from the upper end layer of a conductive material, in different levels. The connection pad 22 is exposed and the fuse link is kept in a coated state by blanket etching. The fuse link can be formed in a step part 38 or the connection pad 22 can be formed on one group of storage cells.
Bibliography:Application Number: JP19960077124