MOUNTING BODY OF ELECTRONIC PART
PURPOSE: To markedly improve electronic parts in mounting density by a method wherein first boards are mechanically joined to the surfaces of second boards upright where connecting terminals are provided. CONSTITUTION: A first board 22 is mechanically joined upright to the surface of a second board...
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Main Authors | , |
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Format | Patent |
Language | English |
Published |
11.10.1996
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Edition | 6 |
Subjects | |
Online Access | Get full text |
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Abstract | PURPOSE: To markedly improve electronic parts in mounting density by a method wherein first boards are mechanically joined to the surfaces of second boards upright where connecting terminals are provided. CONSTITUTION: A first board 22 is mechanically joined upright to the surface of a second board 80 where connecting terminals are provided. Furthermore, The boards 22 and 80 are electrically connected together through such a manner that connecting terminals provided to the surface of the board 22 nearly vertical to its surface where parts are mounted are connected to connecting terminals provided to the surface of the second board 80 opposite to its surface where mounting terminals are provided. Electronic parts are mounted on both the sides of the first board 20. Mounting bodies 72 assembled as mentioned above are mounted on a back board 33 upright. As the second boards 80 are provided between the first board 22 and the back board 33, a mounting structure of this constitution is capable of dealing easily with electronic parts each provided with many terminals. |
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AbstractList | PURPOSE: To markedly improve electronic parts in mounting density by a method wherein first boards are mechanically joined to the surfaces of second boards upright where connecting terminals are provided. CONSTITUTION: A first board 22 is mechanically joined upright to the surface of a second board 80 where connecting terminals are provided. Furthermore, The boards 22 and 80 are electrically connected together through such a manner that connecting terminals provided to the surface of the board 22 nearly vertical to its surface where parts are mounted are connected to connecting terminals provided to the surface of the second board 80 opposite to its surface where mounting terminals are provided. Electronic parts are mounted on both the sides of the first board 20. Mounting bodies 72 assembled as mentioned above are mounted on a back board 33 upright. As the second boards 80 are provided between the first board 22 and the back board 33, a mounting structure of this constitution is capable of dealing easily with electronic parts each provided with many terminals. |
Author | MATSUYAMA HARUHIKO YAMAMURA HIDEO |
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Notes | Application Number: JP19950067888 |
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RelatedCompanies | HITACHI LTD |
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Snippet | PURPOSE: To markedly improve electronic parts in mounting density by a method wherein first boards are mechanically joined to the surfaces of second boards... |
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SubjectTerms | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
Title | MOUNTING BODY OF ELECTRONIC PART |
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