SEMICONDUCTOR PACKAGE ENABLING DIRECT DIE-ATTACHMENT

PURPOSE: To provide an inexpensive and highly reliable semiconductor package which enables direct adhesion without adopting die-attaching technique which is usually used when mounting a semiconductor element in a a semiconductor package production process. CONSTITUTION: A semiconductor package is ob...

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Main Authors NAGAMINE KUNIHIRO, KANEMITSU KINICHI, TAKAHASHI SEIICHI, MINETA NAOSHI
Format Patent
LanguageEnglish
Published 17.05.1996
Edition6
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Abstract PURPOSE: To provide an inexpensive and highly reliable semiconductor package which enables direct adhesion without adopting die-attaching technique which is usually used when mounting a semiconductor element in a a semiconductor package production process. CONSTITUTION: A semiconductor package is obtained, wherein a metallic base substrate with a copper foil layer wherein a circuit is machined through an insulation layer on a metallic plate is used and a semiconductor element is thermally compressed directly on an adherent insulation layer wherein a semiconductor package with a brim part which is machined into a soup dish shape through press molding, etc., in the metallic base substrate.
AbstractList PURPOSE: To provide an inexpensive and highly reliable semiconductor package which enables direct adhesion without adopting die-attaching technique which is usually used when mounting a semiconductor element in a a semiconductor package production process. CONSTITUTION: A semiconductor package is obtained, wherein a metallic base substrate with a copper foil layer wherein a circuit is machined through an insulation layer on a metallic plate is used and a semiconductor element is thermally compressed directly on an adherent insulation layer wherein a semiconductor package with a brim part which is machined into a soup dish shape through press molding, etc., in the metallic base substrate.
Author KANEMITSU KINICHI
NAGAMINE KUNIHIRO
TAKAHASHI SEIICHI
MINETA NAOSHI
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SubjectTerms CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
Title SEMICONDUCTOR PACKAGE ENABLING DIRECT DIE-ATTACHMENT
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