CONDUCTIVE PACKAGING MATERIAL
PURPOSE:To provide an inexpensive packaging material high in electrostatic breakdown preventing effect. CONSTITUTION:A synthetic resin layer 3 to which conductivity is imparted is provided on at least one surface of an insulating synthetic resin layer 2 to form a conductive material. A packaging mat...
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Main Author | |
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Format | Patent |
Language | English |
Published |
24.10.1995
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Edition | 6 |
Subjects | |
Online Access | Get full text |
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Summary: | PURPOSE:To provide an inexpensive packaging material high in electrostatic breakdown preventing effect. CONSTITUTION:A synthetic resin layer 3 to which conductivity is imparted is provided on at least one surface of an insulating synthetic resin layer 2 to form a conductive material. A packaging material is formed so that the insulating synthetic resin layer 2 of the conductive material 1 becomes outside and the conductive synthetic resin layer 3 thereof becomes inside. By this constitution, the charge due to the friction with content is rapidly diffused by the conductive synthetic resin layer 3 and the direct discharge from the outside is blocked by the insulating synthetic resin layer 2. |
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Bibliography: | Application Number: JP19940068649 |