CHIP COMPONENT BOARD MOUNTING METHOD

PURPOSE:To largely improve an operating efficiency when a chip component is mounted on a printed circuit board by recognizing the thickness of the component to be newly mounted on the board, and regulating the head lifting amount of a suction head in response to the thickness at each recognition of...

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Bibliographic Details
Main Author WATANABE MICHIYUKI
Format Patent
LanguageEnglish
Published 11.08.1995
Edition6
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
COMBINED OPERATIONS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MACHINE TOOLS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
OTHER WORKING OF METAL
PERFORMING OPERATIONS
PRINTED CIRCUITS
TRANSPORTING
UNIVERSAL MACHINE TOOLS
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Summary:PURPOSE:To largely improve an operating efficiency when a chip component is mounted on a printed circuit board by recognizing the thickness of the component to be newly mounted on the board, and regulating the head lifting amount of a suction head in response to the thickness at each recognition of the thickness. CONSTITUTION:After a suction head 13 for sucking a chip component 11 to be supplied from a cassette 12 is moved down, the thickness of the component 11 newly mounted on a printed circuit board is recognized. Then, the suitable amount of a head lifting amount of the head 13 is calculated from the thickness of the recognized component 1. Thereafter, the head 13 is actually lifted based on the calculated value of the lift, moved at X-Y axes above the board, the head 13 is again moved down to mount the component 11 at a predetermined position of the board. As a result, a plurality of types of the components 1 having various thicknesses can be sequentially efficiently mounted.
Bibliography:Application Number: JP19940005982