HEATER AND THERMAL HEAD

• Main Authors: KOMATSU MICHIYASU, SATOU YOSHITOSHI, YAMAGA MINEYUKI
• Format: Patent
• Language: English
• Published: 28.07.1995
• Edition: 6
• Subjects: BASIC ELECTRIC ELEMENTS; CORRECTION OF TYPOGRAPHICAL ERRORS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; LINING MACHINES; PERFORMING OPERATIONS; PRINTING; RESISTORS; SELECTIVE PRINTING MECHANISMS; SEMICONDUCTOR DEVICES; STAMPS; TRANSPORTING; TYPEWRITERS

PURPOSE:To enable printing at higher speed by mounting a heater having high thermal conductivity and excellent thermal response. CONSTITUTION:A heater contains rare earth elements in 1.0-7.5 wt. %, in terms of an oxide and Li, Na, K, Fe, Ca, Mg, Sr, Ba, Mn and B as impurity cation elements in 0.3wt.% or less in total, and is composed of a high thermal conductivity silicon nitride substrate 7 having thermal conductivity larger than 60W/m.K or silicon nitride particles and a grain boundary phase. A crystal compound phase in the grain boundary phase occupies 20% or more at a volume ratio to the whole grain boundary phase, and a heating resistor 2 is arranged integrally onto the high thermal conductivity silicon nitride substrate 7 having thermal conductivity larger than 60W/m.K. An insulator layer is formed onto the substrate so as to cover the heating resistor 2, and the insulator layer may also be constituted of the high thermal conductivity silicon nitride substrate 7. A thermal head is configured by integrally laminating the heating resistor 2 and an abrasion-resistant layer 5 on the surface of the high thermal conductivity silicon nitride substrate 7.