SEMICONDUCTOR DEVICE

• Main Author: OGATA TOSHIICHI
• Format: Patent
• Language: English
• Published: 02.05.1995
• Edition: 6
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PURPOSE:To enable a packaging cap to be easily and accurately mounted on a packaging substrate by a method wherein a pawl member is provided to the side wall of the packaging cap, a cutout is provided to an outer lead terminal fixed to the packaging substrate, and then the packaging cap is fixed to the packaging board. CONSTITUTION:An input outer lead terminal 3a, an output outer lead terminal 3b, and grounding outer lead terminals 11 are fixed at prescribed positions to the upside of a ceramic substrate 2 fixed onto a heat dissipating fin 1 the same as conventional, and then a wafer process is finished, a semiconductor chip obtained by dicing is die-bonded to the upside center of the ceramic substrate 2, and wire bonding operation is successively carried out. Then, the base of the side wall of a ceramic cap 10 is made to confront a device main body and so mounted on the device main body as to house a semiconductor chip in the inner space of the ceramic cap 10, and an adequate load is applied to the ceramic cap 10 from above to enable a pawl member 10a provided to the ceramic cap 10 to be engaged with the cutout of the grounding outer lead terminal 11.