TRANSFER OF PRINTED-WIRING BOARD AND TRANSFER DEVICE

• Main Authors: TANIZAKI TOSHIO, MASUDA WATARU
• Format: Patent
• Language: English
• Published: 24.06.1994
• Edition: 5
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CONVEYING; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; HANDLING THIN OR FILAMENTARY MATERIAL; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PACKING; PERFORMING OPERATIONS; PNEUMATIC TUBE CONVEYORS; PRINTED CIRCUITS; SHOP CONVEYOR SYSTEMS; STORING; TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING ORTIPPING; TRANSPORTING

PURPOSE:To provide a method of transferring a printed-wiring board which is used for various electronic equipments, specially a printed-wiring board having a comparatively thin plate thickness, which improves remarkedly an increase in the uniformity of the film thickness of a solder resist, the yield of the manufacture of the board in a solder resist formation process and the productivity of the board and improves also the reliability of the electronic equipments, and a transfer device for the printed-wiring board. CONSTITUTION:A printed-wiring board 23 formed with a conductor pattern is made to incline and float in the direction rectangular to the transfer direction of the board 23 with gas 27, which is jetted from the lower part of the board, and the board 23 is moved by inclined rotators 26 to come into contact to the end part, which is positioned on the inclined side of the board 23, of the board 23, whereby at the time of preheating of the board 23, coating with solder resist ink 22b for photo developing on the board 23 and transfer of the board 23 to a dry to touch part, a solder resist formation extent on the board 23 can be held in a non-contact state.