CHIP COMPONENT SORTING DEVICE

• Main Authors: KAJIKAWA KOJI, YOROZU KATSUHIKO
• Format: Patent
• Language: English
• Published: 10.06.1994
• Edition: 5
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CONVEYING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; HANDLING THIN OR FILAMENTARY MATERIAL; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PACKING; PERFORMING OPERATIONS; PNEUMATIC TUBE CONVEYORS; POSTAL SORTING; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES; SEPARATING SOLIDS FROM SOLIDS; SHOP CONVEYOR SYSTEMS; SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTEDPIECE-MEAL, e.g. BY PICKING; STORING; TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING ORTIPPING; TRANSPORTING

PURPOSE:To automatically and continuously sort only chip components whose lateral or longitudinal size exceeds a maximum allowable value so that they are selectively eliminated from a transfer path in a sorting device in which a gate body having a passage groove for a chip component is disposed in the transfer path which conveys chip components arrayed in a line. CONSTITUTION:A gate body 1 provided with a sensor 10 for detecting a chip component 2 in a passage groove 5 of the gate body, whilst a suction port 7 for sucking a chip component 2 from the passage groove 5 is created on a closure body 6 that is movable relative to the gate body 1. This closure body 6 travels in a reciprocating fashion between the location where the suction port 7 faces the inside of the passage groove 5 and the location where the suction port 7 is apart from the passage groove 5.