COMPOUND FOR HEAT-RESISTANT LAMINATE, AND PRODUCTION OF HEAT-RESISTANT LAMINATE

• Main Authors: FURUYA HIROYUKI, IDA JIYUNYA
• Format: Patent
• Language: English
• Published: 24.05.1994
• Edition: 5
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CHEMISTRY; COMPOSITIONS BASED THEREON; GENERAL PROCESSES OF COMPOUNDING; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; WORKING-UP

PURPOSE:To provide the title compd. excellent in heat resistance, moisture resistance, and storage stability by using a specific imide compd. as the main component. CONSTITUTION:The title compd. mainly comprises a compd. of formula I wherein Ar1 is a same or different tetravalent arom. group; Ar2 is a same or different divalent arom. group; X is a same or different trivalent linkage selected from formulae II, III, and IV; n is 0-15; and R is a reactive group. The compd. is dissolved in an org. solvent to give a varnish, which is applied to or impregnated into a reinforcing material and dried to a specified residual-solvent concn. to give a prepreg. At least one sheet of the prepreg is sandwiched between two sheets of copper foil and integrally molded by thermal pressing, thus giving a double-side copper-clad laminate. Post-curing is effective in improving the heat resistance and mechanical strengths of the laminate.