COLLECTING METHOD FOR POLISHED WAFER

• Main Author: MASUKATA YOSHIMASA
• Format: Patent
• Language: English
• Published: 14.05.1993
• Subjects: BASIC ELECTRIC ELEMENTS; DRESSING OR CONDITIONING OF ABRADING SURFACES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; PERFORMING OPERATIONS; POLISHING; SEMICONDUCTOR DEVICES; TRANSPORTING

PURPOSE:To prevent breakage and damage of a wafer by separating upper and lower fixing boards in a water or the other liquid bath at the time of collecting a polished wafer. CONSTITUTION:A wafer 5 held by a carrier 4 is clamped by upper and lower surface plates 1, 2 under suitable pressure, and whil...