TOP COVER TAPE FOR EMBOSS CARRIER TAPE

PURPOSE:To obtain a peeling off characteristic satisfactory for the JIS standard and a baking-proof property, by providing a pierced cut in the longitudinal direction, partitioning property, by providing a pierced cut in the longitudinal direction, partitioning an expected opening part of a substrat...

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Bibliographic Details
Main Author KAMATA MAMORU
Format Patent
LanguageEnglish
Published 04.11.1992
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Summary:PURPOSE:To obtain a peeling off characteristic satisfactory for the JIS standard and a baking-proof property, by providing a pierced cut in the longitudinal direction, partitioning property, by providing a pierced cut in the longitudinal direction, partitioning an expected opening part of a substrate at the inside face of an emboss carrier tape and laminated the substrate and the external layer material through a resin layer with low adhesive strength and an adhesive layer with a high adhesive strength. CONSTITUTION:A pierces cut 15 partitioning an expected opening part 16 for taping is provided longitudinally on a substrate 11 of a top cover tape. And the substrate 11 and an external layer material 12 are laminated through a resin layer 13 with a low adhesive strength and an adhesion layer 14. In this way, it becomes possible to use material having a barrier or antistatic materials as an outside layer material and the tape becomes suitable for packaging of electronic components. And the base substrate inside the pierced cut is broken with the external material to form the opening and hence, the electronic components can be taken out.
Bibliography:Application Number: JP19910070999