POLYIMIDE ADHESIVE COMPOSITION

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Bibliographic Details
Main Authors CHIEN KOO MIN, SHIAO KUO YUI, CHIYAN UEN CHIYAN, BAN CHIN BIN, WAN TSUON SHIYON
Format Patent
LanguageEnglish
Published 30.06.1992
Subjects
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CHEMISTRY
DYES
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
POLISHES
PRINTED CIRCUITS
USE OF MATERIALS AS ADHESIVES
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Author CHIEN KOO MIN
WAN TSUON SHIYON
BAN CHIN BIN
CHIYAN UEN CHIYAN
SHIAO KUO YUI
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– fullname: CHIYAN UEN CHIYAN
– fullname: BAN CHIN BIN
– fullname: WAN TSUON SHIYON
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  day: 30
PublicationDecade 1990
PublicationYear 1992
RelatedCompanies TSUAITOWAN FUAAREN GONIE JISHIYUU IENJIOU YUEN
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SubjectTerms ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CHEMISTRY
DYES
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
POLISHES
PRINTED CIRCUITS
USE OF MATERIALS AS ADHESIVES
Title POLYIMIDE ADHESIVE COMPOSITION
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