MANUFACTURE OF MULTILAYER PRINTED CIRCUIT BOARD

• Main Authors: NAKASO AKISHI, MINAGAWA KAZUYASU, HATAKEYAMA SHUICHI, KIDA AKINARI, URASAKI NAOYUKI
• Format: Patent
• Language: English
• Published: 26.12.1991
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

PURPOSE:To prevent and suppress generation of negative etchback by covering a conductor circuit in a through hole or a nonthrough hole with etching resist when metal copper and copper oxide or only metal copper is melted to be removed from an insulation organic board. CONSTITUTION:Copper foils are f...