MANUFACTURE OF MULTILAYER PRINTED CIRCUIT BOARD

PURPOSE:To prevent and suppress generation of negative etchback by covering a conductor circuit in a through hole or a nonthrough hole with etching resist when metal copper and copper oxide or only metal copper is melted to be removed from an insulation organic board. CONSTITUTION:Copper foils are f...

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Bibliographic Details
Main Authors NAKASO AKISHI, MINAGAWA KAZUYASU, HATAKEYAMA SHUICHI, KIDA AKINARI, URASAKI NAOYUKI
Format Patent
LanguageEnglish
Published 26.12.1991
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:PURPOSE:To prevent and suppress generation of negative etchback by covering a conductor circuit in a through hole or a nonthrough hole with etching resist when metal copper and copper oxide or only metal copper is melted to be removed from an insulation organic board. CONSTITUTION:Copper foils are formed as outermost layers, and so laminated together with an inner layer circuit that the forming surface of a copper oxide 1 is brought into contact with a base material 2 of insulating organic material. A through hole or nonthrough hole is formed, and smeared as required. An inner layer conductor 3 in the through or nonthrough hole is covered with insoluble or hard soluble substance to copper etchant. The surface of a board is polished to expose the foil. Metal copper and copper oxide or only the metal copper is removed from the organic base material. As required, the conductor covering substance in the through or nonthrough hole is removed, and wired including electroless plating to form a wiring.
Bibliography:Application Number: JP19900098779