PACKAGE OF SEMICONDUCTOR ACCELERATION SENSOR

PURPOSE:To enable prevention of breakdown of a semiconductor cantilever even when an impact is applied from outside, by a construction wherein a base fitted with a semiconductor acceleration sensor is fitted inside a case with buffering supports interposed. CONSTITUTION:Buffering supports 15 are for...

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Bibliographic Details
Main Author OZAWA HIROMASA
Format Patent
LanguageEnglish
Published 02.10.1991
Subjects
CONSTRUCTIONAL DETAILS OF INSTRUMENTS, OR COMPARABLE DETAILSOF OTHER APPARATUS, NOT OTHERWISE PROVIDED FOR
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PHYSICS
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Summary:PURPOSE:To enable prevention of breakdown of a semiconductor cantilever even when an impact is applied from outside, by a construction wherein a base fitted with a semiconductor acceleration sensor is fitted inside a case with buffering supports interposed. CONSTITUTION:Buffering supports 15 are formed of a material selected to cope with an acceleration to be impressed, such as a synthetic rubber material or a plastic elastomer, for instance. One head part 15a of the buffer support 15 is put, with elastic deformation, in a hole part 14 provided in a case 14 and then restores to the original state to be fixed therein, while the other head part 15a is passed through a hole of a base 12 and then let to restore to the original state, and the buffering supports 15 thus prepared support the base 12 in a buffering manner. When an impact is applied in the direction A, in this device, it is buffered by the buffering supports 15 and propagated to the base 12 in a reduced state, and thus the breakdown of a semiconductor cantilever of the semiconductor acceleration sensor 11 is prevented.
Bibliography:Application Number: JP19900125807