METHOD FOR REMOVING SCATTERED PHOTORESIST
PURPOSE:To facilitate removal of a scattered photoresist by forming a specified polymer film in a spin cup and then coating it with the photoresist and peeling the film. CONSTITUTION:The polymer film 9 is formed by coating all the inside surface of the spin cup 1 with an easily peelable material, su...
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Main Authors | , |
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Format | Patent |
Language | English |
Published |
02.02.1990
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Subjects | |
Online Access | Get full text |
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Abstract | PURPOSE:To facilitate removal of a scattered photoresist by forming a specified polymer film in a spin cup and then coating it with the photoresist and peeling the film. CONSTITUTION:The polymer film 9 is formed by coating all the inside surface of the spin cup 1 with an easily peelable material, such as polyurethane, insoluble in the scattered photoresist 5 and capable of adsorbing it and then a photoresist is applied on the film 9. After forming the photoresist film, the film 9 having the scattered photoresist 5 attached is peeled off and the scattered photoresist 5 is removed, thus permitting the scattered photoresist 5 to be adsorbed by the film 9, accordingly, not to bounce from the film 9 and not to attach on to a wafer 4, and removal of the scattered photoresist 5 using a rinsing solution to be not necessary. |
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AbstractList | PURPOSE:To facilitate removal of a scattered photoresist by forming a specified polymer film in a spin cup and then coating it with the photoresist and peeling the film. CONSTITUTION:The polymer film 9 is formed by coating all the inside surface of the spin cup 1 with an easily peelable material, such as polyurethane, insoluble in the scattered photoresist 5 and capable of adsorbing it and then a photoresist is applied on the film 9. After forming the photoresist film, the film 9 having the scattered photoresist 5 attached is peeled off and the scattered photoresist 5 is removed, thus permitting the scattered photoresist 5 to be adsorbed by the film 9, accordingly, not to bounce from the film 9 and not to attach on to a wafer 4, and removal of the scattered photoresist 5 using a rinsing solution to be not necessary. |
Author | KISHIMURA SHINJI YAMAGUCHI ATSUMI |
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Notes | Application Number: JP19880184013 |
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RelatedCompanies | MITSUBISHI ELECTRIC CORP |
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Snippet | PURPOSE:To facilitate removal of a scattered photoresist by forming a specified polymer film in a spin cup and then coating it with the photoresist and peeling... |
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SubjectTerms | APPARATUS SPECIALLY ADAPTED THEREFOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PERFORMING OPERATIONS PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL SEMICONDUCTOR DEVICES SPRAYING OR ATOMISING IN GENERAL TRANSPORTING |
Title | METHOD FOR REMOVING SCATTERED PHOTORESIST |
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