METHOD FOR REMOVING SCATTERED PHOTORESIST

• Main Authors: YAMAGUCHI ATSUMI, KISHIMURA SHINJI
• Format: Patent
• Language: English
• Published: 02.02.1990
• Subjects: APPARATUS SPECIALLY ADAPTED THEREFOR; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL; BASIC ELECTRIC ELEMENTS; CINEMATOGRAPHY; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROGRAPHY; HOLOGRAPHY; MATERIALS THEREFOR; ORIGINALS THEREFOR; PERFORMING OPERATIONS; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL; SEMICONDUCTOR DEVICES; SPRAYING OR ATOMISING IN GENERAL; TRANSPORTING

PURPOSE:To facilitate removal of a scattered photoresist by forming a specified polymer film in a spin cup and then coating it with the photoresist and peeling the film. CONSTITUTION:The polymer film 9 is formed by coating all the inside surface of the spin cup 1 with an easily peelable material, such as polyurethane, insoluble in the scattered photoresist 5 and capable of adsorbing it and then a photoresist is applied on the film 9. After forming the photoresist film, the film 9 having the scattered photoresist 5 attached is peeled off and the scattered photoresist 5 is removed, thus permitting the scattered photoresist 5 to be adsorbed by the film 9, accordingly, not to bounce from the film 9 and not to attach on to a wafer 4, and removal of the scattered photoresist 5 using a rinsing solution to be not necessary.