METHOD FOR REMOVING SCATTERED PHOTORESIST
PURPOSE:To facilitate removal of a scattered photoresist by forming a specified polymer film in a spin cup and then coating it with the photoresist and peeling the film. CONSTITUTION:The polymer film 9 is formed by coating all the inside surface of the spin cup 1 with an easily peelable material, su...
Saved in:
Main Authors | , |
---|---|
Format | Patent |
Language | English |
Published |
02.02.1990
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Summary: | PURPOSE:To facilitate removal of a scattered photoresist by forming a specified polymer film in a spin cup and then coating it with the photoresist and peeling the film. CONSTITUTION:The polymer film 9 is formed by coating all the inside surface of the spin cup 1 with an easily peelable material, such as polyurethane, insoluble in the scattered photoresist 5 and capable of adsorbing it and then a photoresist is applied on the film 9. After forming the photoresist film, the film 9 having the scattered photoresist 5 attached is peeled off and the scattered photoresist 5 is removed, thus permitting the scattered photoresist 5 to be adsorbed by the film 9, accordingly, not to bounce from the film 9 and not to attach on to a wafer 4, and removal of the scattered photoresist 5 using a rinsing solution to be not necessary. |
---|---|
Bibliography: | Application Number: JP19880184013 |