MANUFACTURE OF PRINTED BOARD

PURPOSE:To prevent a plating resist from separating or swelling so as to enable the formation of a fine pattern by a method wherein a pattern chemical copper plating is executed at a certain potential specified to that of a reference hydrogen electrode. CONSTITUTION:A second metal layer 3 is provide...

Full description

Saved in:
Bibliographic Details
Main Authors WAJIMA MOTOYO, KAWAMOTO MINEO, TOBA RITSUJI, MIYAZAKI MASASHI, MURAKAMI KANJI, AKABOSHI HARUO
Format Patent
LanguageEnglish
Published 27.12.1990
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CHEMICAL SURFACE TREATMENT
CHEMISTRY
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING MATERIAL WITH METALLIC MATERIAL
COATING METALLIC MATERIAL
DIFFUSION TREATMENT OF METALLIC MATERIAL
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METALLURGY
PRINTED CIRCUITS
SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
Online AccessGet full text

Cover

More Information
Summary:PURPOSE:To prevent a plating resist from separating or swelling so as to enable the formation of a fine pattern by a method wherein a pattern chemical copper plating is executed at a certain potential specified to that of a reference hydrogen electrode. CONSTITUTION:A second metal layer 3 is provided onto a copper layer 2 on an insulating board 1, which is masked with a plating resist 4 excluding a circuit forming part, and a pattern chemical copper plating 5 is carried out onto the required circuit forming part. The pattern chemical copper plating 5 is executed at a plating reaction potential higher than the potential of a reference hydrogen electrode by -550mV. After plating, an etching resist is formed through solder plating 6, then the plating resist 4 is removed, the parts of the second metal layer 3 and the copper layer 2 covered with the plating resist 4 are removed through etching, the solder plating layer 6 is removed, and the circuit pattern of a printed board is formed. By this setup, a plating resist can be prevented from separating or swelling, and a fine pattern can be formed.
Bibliography:Application Number: JP19890132615