ELECTRODE FORMATION OF SILICON CARBIDE SEMICONDUCTOR ELEMENT
PURPOSE:To form an electrode in n-type SiC capable of firm wire-bonding process by a method wherein an Au/Ni electrode film is laminated on an n-type silicon carbide to be heat-treated at high temperature and then an Au/Cr electrode film is laminated on the Au/Ni electrode to be heat-treated at low...
Saved in:
Main Authors | , , |
---|---|
Format | Patent |
Language | English |
Published |
24.04.1990
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Be the first to leave a comment!