ELECTRODE FORMATION OF SILICON CARBIDE SEMICONDUCTOR ELEMENT

PURPOSE:To form an electrode in n-type SiC capable of firm wire-bonding process by a method wherein an Au/Ni electrode film is laminated on an n-type silicon carbide to be heat-treated at high temperature and then an Au/Cr electrode film is laminated on the Au/Ni electrode to be heat-treated at low...

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Bibliographic Details
Main Authors NAKADA TOSHITAKE, OTA KIYOSHI, FUJIKAWA YOSHIHARU
Format Patent
LanguageEnglish
Published 24.04.1990
Subjects
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