JP2795788B
In mounting a semiconductor chip on a circuit board by a flip chip bonding method, an improved mounting method holds the circuit with a warp prevention device, on which the semiconductor chip is placed, while the circuit board is treated with heat for the reflow of the solder bumps. As a result, the...
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| Main Author | |
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| Format | Patent |
| Language | English |
| Published |
10.09.1998
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| Edition | 6 |
| Subjects | |
| Online Access | Get full text |
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| Abstract | In mounting a semiconductor chip on a circuit board by a flip chip bonding method, an improved mounting method holds the circuit with a warp prevention device, on which the semiconductor chip is placed, while the circuit board is treated with heat for the reflow of the solder bumps. As a result, the circuit board is prevented from warping when heated at a temperature at which the solder bumps melt. |
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| AbstractList | In mounting a semiconductor chip on a circuit board by a flip chip bonding method, an improved mounting method holds the circuit with a warp prevention device, on which the semiconductor chip is placed, while the circuit board is treated with heat for the reflow of the solder bumps. As a result, the circuit board is prevented from warping when heated at a temperature at which the solder bumps melt. |
| Author | RAI AKITERU |
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| Notes | Application Number: JP19930029046 |
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| PublicationDate | 19980910 |
| PublicationDateYYYYMMDD | 1998-09-10 |
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| PublicationYear | 1998 |
| RelatedCompanies | SHAAPU KK |
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| Snippet | In mounting a semiconductor chip on a circuit board by a flip chip bonding method, an improved mounting method holds the circuit with a warp prevention device,... |
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| SubjectTerms | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| Title | JP2795788B |
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