SEMICONDUCTOR DEVICE HAVING ANTENNA

• Main Authors: IKEDA JUNYA, NAKADA YOSHIHIRO, SASAKI SHINYA
• Format: Patent
• Language: English; Japanese
• Published: 26.03.2024
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

To provide a compact semiconductor device having an antenna.SOLUTION: A semiconductor device having an antenna comprises: a radiator plate having a first surface and a second surface; a semiconductor chip provided on the second surface of the radiator plate; a wiring board having a first board surface provided on the first surface of the radiator plate and a second board surface provided on the opposite side to the first board surface, the wiring board being formed from laminating a resin insulation layer and a metal wiring layer, the wiring board covering side surfaces of the radiator plate and the semiconductor chip and a circuit surface located on the opposite side to the radiator plate of the semiconductor chip, and exposing the first surface of the radiator plate to the first board surface; and an antenna provided on the second broad surface of the wiring board. The wiring board comprises a board connector provided on the first board surface, a first wiring line connecting the board connector and a first terminal provided on the circuit surface of the semiconductor chip, and a second wiring line connecting the antenna and a second terminal provided on the circuit surface of the semiconductor chip.SELECTED DRAWING: Figure 1 【課題】小型化が可能なアンテナ付き半導体装置を提供する。【解決手段】アンテナ付き半導体装置は、第１面及び第２面を有する放熱板と、前記放熱板の第２面側に設けられる半導体チップと、前記放熱板の前記第１面側に位置する第１基板面と、前記第１基板面とは反対側に位置する第２基板面とを有し、樹脂製の絶縁層と金属製の配線層とが積層された配線基板であって、前記放熱板及び前記半導体チップの側面と、前記半導体チップの前記放熱板側とは反対側にある回路面とを覆い、前記第１基板面に前記放熱板の前記第１面を露出させる配線基板と、前記配線基板の前記第２基板面に設けられるアンテナとを有し、前記配線基板は、前記第１基板面に設けられる基板接続部と、前記基板接続部と前記半導体チップの前記回路面に設けられる第１端子とを接続する第１配線と、前記アンテナと前記半導体チップの前記回路面に設けられる第２端子とを接続する第２配線とを有する。【選択図】図１