SOLID-STATE IMAGING ELEMENT PACKAGE AND METHOD FOR MANUFACTURING SOLID-STATE IMAGING ELEMENT PACKAGE

• Main Authors: KUTSUMIZU MAKOTO, KINOSHITA DAIKI, KURODA KENTA
• Format: Patent
• Language: English; Japanese
• Published: 22.03.2024
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

To provide a solid-state imaging element package which can take a high-quality image.SOLUTION: A solid-state imaging element package 1 according to an embodiment of the present invention includes: a solid-state imaging element 20 having a functioning unit 21 for imaging and a margin unit 22 surround...