SOLID-STATE IMAGING ELEMENT PACKAGE AND METHOD FOR MANUFACTURING SOLID-STATE IMAGING ELEMENT PACKAGE

To provide a solid-state imaging element package which can take a high-quality image.SOLUTION: A solid-state imaging element package 1 according to an embodiment of the present invention includes: a solid-state imaging element 20 having a functioning unit 21 for imaging and a margin unit 22 surround...

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Bibliographic Details
Main Authors KUTSUMIZU MAKOTO, KINOSHITA DAIKI, KURODA KENTA
Format Patent
LanguageEnglish
Japanese
Published 22.03.2024
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:To provide a solid-state imaging element package which can take a high-quality image.SOLUTION: A solid-state imaging element package 1 according to an embodiment of the present invention includes: a solid-state imaging element 20 having a functioning unit 21 for imaging and a margin unit 22 surrounding the functioning unit 21; a frame 30 arranged in the margin unit 22; a transparent substrate 40 fixed to the frame 30 to cover the functioning unit 21. Parts 31, 32, 33, and 34 of the frame 30 are formed of a resin composition with a different composition from other part 35.SELECTED DRAWING: Figure 1 【課題】撮影画像の画像品質が高い固体撮像素子パッケージを提供すること。【解決手段】本発明の一態様に係る固体撮像素子パッケージ１は、撮像を行う機能部２１および前記機能部２１を取り囲むマージン部２２を有する固体撮像素子２０と、前記マージン部２２に配設される枠状のフレーム３０と、前記機能部２１を覆うよう前記フレーム３０に固定される透明基板４０と、を備え、前記フレーム３０の一部分３１，３２，３３，３４は、他の部分３５と組成が異なる樹脂組成物から形成される。【選択図】図１
Bibliography:Application Number: JP20220143763