PROTECTIVE FILM FOR ELECTRONIC COMPONENT PROCESSING AND METHOD FOR PRODUCING ELECTRONIC COMPONENT

• Main Authors: ITO HIROYUKI, FURIHATA WATARU, MURAKAMI YUKA, SAKURAYAMA TAKAO, UCHIDA HIROAKI
• Format: Patent
• Language: English; Japanese
• Published: 18.03.2024
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CHEMISTRY; DYES; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; POLISHES; USE OF MATERIALS AS ADHESIVES

To provide a protective film for electronic component processing having high fixing force of a substrate for an electronic component and excellent in detachability.SOLUTION: The present disclosure relates to a protective film for electronic component processing, which has a base material and an adhesive layer arranged on one surface of the base material, wherein when the protective film for electronic component processing is attached to a SUS board and pulled in parallel with the protective film for electronic component processing and an adhesive surface of the SUS board, maximum shear stress is 0.2 MPa or more, and release strength of the protective film for electronic component processing to an adhesive tape (No. 31B manufactured by Nitto Denko Corporation) is 5 N/25 mm or less.SELECTED DRAWING: Figure 1 【課題】電子部品用基板の固定力が高く、剥離性に優れる電子部品加工用保護フィルムを提供する。【解決手段】本開示は、基材と、上記基材の一方の面に配置された粘着層と、を有する電子部品加工用保護フィルムであって、上記電子部品加工用保護フィルムをＳＵＳ板に貼り付け、上記電子部品加工用保護フィルムおよび上記ＳＵＳ板の粘着面に平行に引っ張ったときの、最大せん断応力が０．２ＭＰａ以上であり、粘着テープ（日東電工社製ＮＯ．３１Ｂ）に対する、上記電子部品加工用保護フィルムの剥離強度が５Ｎ／２５ｍｍ以下である、電子部品加工用保護フィルムを提供する。【選択図】図１