THERMAL STORAGE MOLDED ARTICLE, CURABLE COMPOSITION, AND ARTICLE

• Main Authors: FURUKAWA NAOKI, SANO ATSUKO, KIZAWA KEIKO, MATSUBARA NOZOMI, NAGAI AKIRA, YOKOTA HIROSHI, MORIMOTO TAKESHI
• Format: Patent
• Language: English; Japanese
• Published: 26.02.2024
• Subjects: ADHESIVES; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; DYES; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; POLISHES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

To provide a thermal storage molded article characterized by a superior thermal storage capacity and formability.SOLUTION: A thermal storage molded article contains a resin and microcapsules that encapsulate a thermal storage component and are dispersed in the resin, the resin containing a cured product of a water-soluble epoxy compound.SELECTED DRAWING: Figure 1 【課題】蓄熱量及び成形性に優れる蓄熱成形体を提供すること。【解決手段】樹脂と、前記樹脂中に分散され、蓄熱成分を内包したマイクロカプセルと、を含有し、樹脂が、水溶性エポキシ化合物の硬化物を含む、蓄熱成形体。【選択図】図１