SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

• Main Authors: YUN TAE WON, EOM SUNG HUN
• Format: Patent
• Language: English; Japanese
• Published: 17.10.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

To provide a substrate processing apparatus and a substrate processing method for cleaning a lower portion of a substrate using ultrasonic waves in order to improve cleaning of the lower portion of the substrate.SOLUTION: A substrate processing apparatus 1000 includes a substrate support unit 1100, supporting a substrate W, and an ultrasonic cleaning module 1200 disposed in a location lower than an upper surface of the substrate support unit. The ultrasonic cleaning module includes a receiving portion receiving a chemical, an opening portion in which at least a portion of an upper surface of the receiving portion is opened, and an ultrasonic vibration unit disposed to be directed toward the opening portion from the receiving portion. A liquid surface of the chemical, rising by the ultrasonic vibration unit, touches the substrate through the opening portion.SELECTED DRAWING: Figure 6 【課題】基板下部の洗浄を改善するために、超音波を活用して基板の下部を洗浄する基板処理装置及び基板処理方法を提供する。【解決手段】基板処理装置１０００は、基板Ｗを支持する基板支持部１１００と、基板支持部の上面より低い位置に配置される超音波洗浄モジュール１２００と、を含む。超音波洗浄モジュールは、薬液を収容する収容部、収容部の上面の少なくとも一部が開放された開放部及び収容部において開放部に向かって配置される超音波振動部を含む。超音波振動部によって上昇する薬液の液面が開放部を介して基板に接触する。【選択図】図６