PHOTOSENSITIVE RESIN COMPOSITION, PHOTOCURED PRODUCT OF PHOTOSENSITIVE RESIN COMPOSITION, AND PRINTED WIRING BOARD HAVING PHOTOCURED FILM OF PHOTOSENSITIVE RESIN COMPOSITION

• Main Authors: KIMURA TAKETO, TAYA FUMIKA, UESUGI NAOYUKI
• Format: Patent
• Language: English; Japanese
• Published: 06.10.2023
• Subjects: APPARATUS SPECIALLY ADAPTED THEREFOR; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CINEMATOGRAPHY; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROGRAPHY; HOLOGRAPHY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; MATERIALS THEREFOR; ORIGINALS THEREFOR; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; PRINTED CIRCUITS

To provide a photosensitive resin composition which enables formation of a protective film that is excellent in flux resistance, matte appearance and flexibility while having insulation reliability.SOLUTION: A photosensitive resin composition contains (A) a carboxyl group-containing photosensitive resin, (B) an inorganic filler, (C) a photopolymerization initiator, (D) a reactive diluent, and (E) an epoxy compound, wherein (B) the inorganic filler is a talc having a particle diameter D50 for 50 vol.% of a cumulative volume percentage of 0.7 μm or more and 5.5 μm or less, and (C) the photopolymerization initiator contains at least one selected from the group consisting of (C1) an α-aminoalkylphenone-based photopolymerization initiator and (C2) an oxime ester-based photopolymerization initiator.SELECTED DRAWING: None 【課題】絶縁信頼性を有しつつ、耐フラックス性、艶消し外観、柔軟性に優れた保護膜を形成できる感光性樹脂組成物を提供する。【解決手段】（Ａ）カルボキシル基含有感光性樹脂と、（Ｂ）無機フィラーと、（Ｃ）光重合開始剤と、（Ｄ）反応性希釈剤と、（Ｅ）エポキシ化合物と、を含有し、前記（Ｂ）無機フィラーが、累積体積百分率が５０体積％の粒子径Ｄ５０が、０．７μｍ以上５．５μｍ以下のタルクであり、前記（Ｃ）光重合開始剤が、（Ｃ１）α－アミノアルキルフェノン系光重合開始剤及び（Ｃ２）オキシムエステル系光重合開始剤からなる群から選択された少なくとも１種を含有する感光性樹脂組成物。【選択図】なし