THERMAL PRINT HEAD, METHOD FOR MANUFACTURING THERMAL PRINT HEAD, AND THERMAL PRINTER

To provide a thermal print head which is suitable for preventing improper short circuit caused by a wiring layer containing silver.SOLUTION: A thermal print head A1 includes a substrate 1 having a main surface 11 facing a z direction (thickness direction), a glaze layer 2 arranged on the main surfac...

Full description

Saved in:
Bibliographic Details
Main Author NAKAYA GORO
Format Patent
LanguageEnglish
Japanese
Published 31.08.2023
Subjects
Online AccessGet full text

Cover

Loading…
More Information
Summary:To provide a thermal print head which is suitable for preventing improper short circuit caused by a wiring layer containing silver.SOLUTION: A thermal print head A1 includes a substrate 1 having a main surface 11 facing a z direction (thickness direction), a glaze layer 2 arranged on the main surface 11, a resistor layer which is arranged on the glaze layer 2 and includes a plurality of heat generation parts arrayed in a main scanning direction, a wiring layer 3 which is arranged on the glaze layer 2 and conducts with the resistor layer, and a protective layer 5 which is arranged on the glaze layer 2 and covers at least the plurality of heat generation parts, wherein the wiring layer 3 has a first layer 31 stacked on the glaze layer 2, and a second layer 32 which is stacked on a part of the first layer 31 and is not covered with the protective layer 5, a component of the first layer 31 contains silver, and a component of the second layer 32 contains a metal element other than the silver.SELECTED DRAWING: Figure 5 【課題】 銀を含む配線層に起因する不当な短絡を防止するのに適したサーマルプリントヘッドを提供する。【解決手段】 サーマルプリントヘッドA1は、z方向(厚さ方向)を向く主面11を有する基板1と、主面11の上に配置されたグレーズ層2と、グレーズ層2の上に配置され、主走査方向に配列された複数の発熱部を含む抵抗体層と、グレーズ層2の上に配置され、且つ前記抵抗体層に導通する配線層3と、グレーズ層2の上に配置され、且つ少なくとも前記複数の発熱部を覆う保護層5と、を備え、配線層3は、グレーズ層2に積層された第1層31と、第1層31の一部分の上に積層され、且つ保護層5に覆われていない第2層32と、を有し、第1層31の構成材料は、銀を含み、第2層32の構成材料は、銀以外の金属元素を含む。【選択図】 図5
Bibliography:Application Number: JP20220024598