THROUGH ELECTRODE SUBSTRATE

• Main Authors: KOIWA YUKIO, YOSHIOKA HIDENORI, KURAMOCHI SATORU
• Format: Patent
• Language: English; Japanese
• Published: 29.08.2023
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

To provide a through electrode substrate which dissolves defects by gas accumulated in gas accumulation in a through hole, prevents falling of a filler in the through hole, and has high reliability, and a semiconductor device.SOLUTION: A through electrode substrate 100 includes a substrate 102 having a through hole 104 penetrating through a first opening 104a of a first surface 102a and a second opening 104b of a second surface 102b, a filler 105 provided inside the through hole 104, and insulation layers 106 and 108 which overlap the through hole 104 in plan view, are brought into contact with the filler 105 exposed to at least one of the first surface 102a and the second surface 102b, and are composed of an insulative resin, wherein there exists a minimum opening 104c having a minimum area M in plan view between the first opening 104a and the second opening 104b, and the insulation layers 106 and 108 act as gas emission parts for emitting gas which is generated in the through hole 104 and is emitted to the outside.SELECTED DRAWING: Figure 1 【課題】貫通孔内のガス溜まりに溜まるガスによる不具合を解消し、貫通孔内の充填物の脱落防止する信頼性の高い貫通電極基板及び半導体装置を提供する。【解決手段】貫通電極基板１００は、第１面１０２ａの第１開口１０４ａと第２面１０２ｂの第２開口１０４ｂとを貫通する貫通孔１０４を有する基板１０２と、貫通孔１０４の内部に設けられた充填物１０５と、平面視において貫通孔１０４と重なり、第１面１０２ａ及び第２面１０２ｂの少なくとも一方に露出した充填物１０５に接する、絶縁性樹脂によって構成された絶縁層１０６、１０８と、を備え、第１開口１０４ａと第２開口１０４ｂとの間に平面視における最小面積Ｍを有する最小開口部１０４ｃが存在し、絶縁脂層１０６、１０８は、貫通孔１０４内で発生し放出されるガスを外部に放出させる気体放出部として作用する。【選択図】図１