THERMALLY CONDUCTIVE COMPOSITION AND CURED PRODUCT THEREOF

• Main Authors: KIMURA TSUNEO, TSUCHIDA KAZUHIRO, ENDO AKIHIRO
• Format: Patent
• Language: English; Japanese
• Published: 23.08.2023
• Subjects: CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

To provide a thermally conductive composition which has fluidity even in the case of containing no solvent, has excellent thermal conductivity and develops sufficient strength after curing and to provide a cured product of thereof.SOLUTION: There is provided a thermally conductive composition which comprises (A) 100 pts.mass of an organopolysiloxane represented by the following formula (1) which is liquid at 23°C (wherein, R is a hydrogen atom, an alkyl group, an aryl group or an alkenyl group, X is a hydrogen atom or an alkyl group, a, b, c and d are a number satisfying 0≤a≤0.8, 0≤b≤0.8, 0.2≤c≤1, 0≤d≤0.8 and a+b+c+d=1 and e is a number satisfying 0≤e≤0.1) and (B) 2,000 to 7,000 pts.mass of a thermally conductive filler and has a viscosity at 25°C of 1,000 Pa s or less.SELECTED DRAWING: None 【課題】溶媒を含まない場合においても流動性を有し、熱伝導性に優れ、かつ硬化後は十分な強度が発現する熱伝導性組成物およびその硬化物を提供すること。【解決手段】（Ａ）下記式（１）で表され、２３℃において液体であるオルガノポリシロキサン：１００質量部、TIFF2023116884000032.tif7111（式中、Ｒは、水素原子、アルキル基、アリール基、アラルキル基またはアルケニル基であり、Ｘは、水素原子またはアルキル基であり、ａ、ｂ、ｃ、ｄは、０≦ａ≦０．８、０≦ｂ≦０．８、０．２≦ｃ≦１、０≦ｄ≦０．８、かつａ＋ｂ＋ｃ＋ｄ＝１を満たす数であり、ｅは、０≦ｅ≦０．１を満たす数である。）、および（Ｂ）熱伝導性充填剤：２，０００～７，０００質量部を含み、２５℃における粘度が、１，０００Ｐａ・ｓ以下である熱伝導性組成物。【選択図】なし