MACHINE TOOL EQUIPPED WITH SWARF DISCHARGER

To effectively move and discharge swarf containing a large amount of linear sward produced in accompany with milling, to a swarf discharge place.SOLUTION: A table movement path 6 in a right and left direction is included behind a column 5 equipped with a main spindle head 3 to which a milling cutter...

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Bibliographic Details
Main Authors SAKAI TERUO, YAMAGUCHI HIRONORI
Format Patent
LanguageEnglish
Japanese
Published 18.08.2023
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Summary:To effectively move and discharge swarf containing a large amount of linear sward produced in accompany with milling, to a swarf discharge place.SOLUTION: A table movement path 6 in a right and left direction is included behind a column 5 equipped with a main spindle head 3 to which a milling cutter can be mounted. A table 10 where a workpiece is placed can move reciprocally on the table movement path 6. Milling cutting is applied to a surface to be machined of the workpiece on a table 10, whereby swarf containing a large amount of linear swarf is produced. A swarf transfer part 13 is included between the table 10 and the column 5, and the table 10 has a swarf movement bar 20 capable of projecting and retracting. The swarf movement bar 20 is in a retracted state in a stop state when the table is present on a base side, and projects to abut on swarf deposit when the table advances. When the table 10 advances to a tip side 9, the swarf deposit moves to a required place 17 by being pushed by the swarf movement bar 20. When the table 10 reversely advances, the swarf movement bar 20 retracts, whereby the swarf deposit is separated.SELECTED DRAWING: Figure 1 【課題】フライス加工に伴い生成される、線状切屑を多く含む切屑を切屑排出場所に効果的に移動させて排出する。【解決手段】フライスを装着可能の主軸ヘッド3を具備するコラム5の後方に、左右方向のテーブル移動路6を有する。ワークを設置するテーブル10が、テーブル移動路6で往復移動できる。テーブル10上のワークの被加工面にフライス加工が施され、線状切屑を多く含む切屑が生成される。テーブル10とコラム5との間に切屑移送路13を有し、テーブル10は、突出且つ後退可能の切屑移動バー20を有する。切屑移動バー20は、テーブルが基側に存する停止状態で後退状態にあり、テーブルが進行する際に突出し切屑堆積物に当接する。テーブル10が先側9に進行すると、切屑移動バー20に押されて切屑堆積物が所要場所17に移動される。テーブル10が逆進行する際に切屑移動バー20が後退して屑堆積物が分離される。【選択図】図1
Bibliography:Application Number: JP20220017418