MOLDING MATERIAL FOR POLYARYLENE SULFIDE RESIN

• Main Authors: NONOKAWA RYUJI, MATSUNO YUICHI, YOKOTA MINE, FUJIMOTO DAIKI
• Format: Patent
• Language: English; Japanese
• Published: 27.07.2023
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; GENERAL PROCESSES OF COMPOUNDING; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; WORKING-UP

To provide a molding material having excellent electromagnetic wave shielding properties, mechanical strength and appearance.SOLUTION: The present invention provides a molding material. Relative to 100 pts.wt. of a resin component comprising (A) 50-99 pts.wt. of a polyarylene sulfide resin (A compon...