APPARATUS FOR TREATING SUBSTRATE AND METHOD FOR TREATING SUBSTRATE

• Main Authors: KIM JU WON, CHOI BYOUNG DOO, PARK DONGWOON, JUNG GI HUN, OH JIN TAEK, KIM TAE SHIN, CHO A RAH
• Format: Patent
• Language: English; Japanese
• Published: 14.06.2023
• Subjects: APPARATUS SPECIALLY ADAPTED THEREFOR; BASIC ELECTRIC ELEMENTS; CINEMATOGRAPHY; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROGRAPHY; HOLOGRAPHY; MATERIALS THEREFOR; ORIGINALS THEREFOR; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; SEMICONDUCTOR DEVICES

To provide a method for treating a substrate.SOLUTION: A method for treating a substrate includes heating a substrate provided with a plurality of thin film layers, including a photoresist layer formed on its surface. During the heating, light is applied to a first thin film layer including a metal among the plurality of thin film layers, to heat the first thin film layer.SELECTED DRAWING: Figure 5 【課題】基板を処理する方法を提供する。【解決手段】基板を処理する方法は、表面に形成されたフォトレジスト層を含む複数の薄膜層が形成された基板を加熱する際、前記複数の薄膜層のうちで金属を含む第１薄膜層に対して光を照射して前記第１薄膜層を加熱する。【選択図】図５