METHOD FOR MANUFACTURING RESIN PLATING MATERIAL, AND ELECTROLESS PLATING DEVICE

• Main Authors: TAKEMOTO FUMITOSHI, ARIMOTO TARO, MIURA MASATAKE
• Format: Patent
• Language: English; Japanese
• Published: 09.06.2023
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; COMPOSITIONS BASED THEREON; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL PROCESSES OF COMPOUNDING; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PRINTED CIRCUITS; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; THEIR PREPARATION OR CHEMICAL WORKING-UP; WORKING-UP

To provide a method for manufacturing a resin plating material with controllability higher than a conventional method without substantially providing unevenness on the surface of a base material.SOLUTION: A method for manufacturing a resin plating material includes: a step (a) of preparing a base material having an insulating resin material; a step (b) of irradiating the surface of the base material with ultraviolet light of a wavelength of 200 nm or less in the atmosphere having an oxygen concentration of 0.01-10 vol.%, and modifying a treatment object region containing the surface of the base material into a microporous layer having a gap of a nm order; a step (c) of coupling a catalyst to the microporous layer; and a step (d) of forming an electroless plating layer on the upper surface of the base material through the catalyst after the step (c).SELECTED DRAWING: Figure 11 【課題】基材の表面に実質的に凹凸を設けることなく、且つ従来よりも制御性の高い方法で、樹脂めっき材を製造する方法を提供する。【解決手段】樹脂めっき材の製造方法は、絶縁性の樹脂材料を含む基材を準備する工程（ａ）と、基材の表面に対して酸素濃度が０．０１体積％～１０体積％の雰囲気中で波長２００ｎｍ以下の紫外線を照射して、前記基材の前記表面を含む処理対象領域をｎｍオーダーの大きさの空隙を含む微孔層に改質する工程（ｂ）と、微孔層に触媒を結合させる工程（ｃ）と、工程（ｃ）の後、基材の上面に、触媒を介して無電解めっき層を形成する工程（ｄ）を有する。【選択図】図１１