SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

• Main Authors: KATO RYOICHI, TANIGUCHI KATSUMI, IKEDA YOSHINARI, MURATA YUMA, NAKAGOME AKITO
• Format: Patent
• Language: English; Japanese
• Published: 02.05.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

To provide a semiconductor device with high reliability and reduced switching loss.SOLUTION: A semiconductor device has an insulating circuit board 1, a power semiconductor element mounted on the insulating circuit board 1, a flat first terminal 81 electrically connected to the power semiconductor element and having a first main surface, a second terminal 82 electrically connected to the power semiconductor element and having a second main surface opposite the first main surface of the first terminal 81, an insulating sheet 83 disposed between the first and second main surfaces, and conductive films 84, 85 disposed at least on one of the first and second main surface sides of the insulating sheet 83.SELECTED DRAWING: Figure 2 【課題】信頼性が高く、スイッチング損失を低減することができる半導体装置を提供する。【解決手段】絶縁回路基板１と、絶縁回路基板１上に搭載されたパワー半導体素子と、パワー半導体素子に電気的に接続され、第１主面を有する平板状の第１端子８１と、パワー半導体素子に電気的に接続され、第１端子８１の第１主面と対向する第２主面を有する第２端子８２と、第１主面と前記第２主面の間に配置された絶縁シート８３と、絶縁シート８３の第１主面側及び第２主面側の少なくとも一方に配置された導電膜８４，８５とを備える。【選択図】図２