SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

To improve throughput in a substrate processing apparatus and to suppress the exclusive floor area thereof.SOLUTION: A substrate processing apparatus comprises: a carrier block comprising a plurality of carrier mounting portions each of which includes a substrate carry-in/carry-out carrier mounting...

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Main Authors TSUCHIYAMA MASASHI, IDE KOSEI, ENOKIDA SUGURU, WATANABE TAKASHI, IIDA NARIAKI
Format Patent
LanguageEnglish
Japanese
Published 14.04.2023
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Abstract To improve throughput in a substrate processing apparatus and to suppress the exclusive floor area thereof.SOLUTION: A substrate processing apparatus comprises: a carrier block comprising a plurality of carrier mounting portions each of which includes a substrate carry-in/carry-out carrier mounting portion; a processing block provided at one of right and left sides with respect to the carrier block; a first carrier mounting portion and a second carrier mounting portion which are the carrier mounting portions and provided side by side in a longitudinal direction in a planar view and at least one of which is the substrate carry-in/carry-out carrier mounting portion; a plurality of substrate mounting portions which are provided at one of right and left sides with respect to a substrate transportation region formed between the first carrier mounting portion and the second carrier mounting portion in the planar view, and are disposed side by side in a vertical direction; a first substrate transportation mechanism provided in the transportation region; and a second substrate transportation mechanism transferring a substrate between a first substrate mounting portion and a second substrate mounting portion which is included in the plurality of substrate mounting portions, and transfers the substrate to the processing block.SELECTED DRAWING: Figure 3 【課題】基板処理装置におけるスループットを高くすると共に、専有床面積を抑える。【解決手段】基板搬入出用のキャリア載置部を含む複数のキャリア載置部を備えるキャリアブロックと、キャリアブロックに対して左右の一方に設けられる処理ブロックと、各々キャリア載置部であると共に平面視で前後方向に並んで設けられ、少なくとも一方が基板搬入出用のキャリア載置部である第1キャリア載置部及び第2キャリア載置部と、平面視での第1キャリア載置部と前記第2キャリア載置部との間に形成される基板の搬送領域に対して左右の一方に設けられ、縦方向に並ぶ複数の基板載置部と、前記搬送領域に設けられる第1基板搬送機構と、第1基板載置部と、複数の基板載置部に含まれると共に処理ブロックに対して基板を受け渡すための第2基板載置部との間で、基板を受け渡す第2基板搬送機構と、を備える装置を構成する。【選択図】図3
AbstractList To improve throughput in a substrate processing apparatus and to suppress the exclusive floor area thereof.SOLUTION: A substrate processing apparatus comprises: a carrier block comprising a plurality of carrier mounting portions each of which includes a substrate carry-in/carry-out carrier mounting portion; a processing block provided at one of right and left sides with respect to the carrier block; a first carrier mounting portion and a second carrier mounting portion which are the carrier mounting portions and provided side by side in a longitudinal direction in a planar view and at least one of which is the substrate carry-in/carry-out carrier mounting portion; a plurality of substrate mounting portions which are provided at one of right and left sides with respect to a substrate transportation region formed between the first carrier mounting portion and the second carrier mounting portion in the planar view, and are disposed side by side in a vertical direction; a first substrate transportation mechanism provided in the transportation region; and a second substrate transportation mechanism transferring a substrate between a first substrate mounting portion and a second substrate mounting portion which is included in the plurality of substrate mounting portions, and transfers the substrate to the processing block.SELECTED DRAWING: Figure 3 【課題】基板処理装置におけるスループットを高くすると共に、専有床面積を抑える。【解決手段】基板搬入出用のキャリア載置部を含む複数のキャリア載置部を備えるキャリアブロックと、キャリアブロックに対して左右の一方に設けられる処理ブロックと、各々キャリア載置部であると共に平面視で前後方向に並んで設けられ、少なくとも一方が基板搬入出用のキャリア載置部である第1キャリア載置部及び第2キャリア載置部と、平面視での第1キャリア載置部と前記第2キャリア載置部との間に形成される基板の搬送領域に対して左右の一方に設けられ、縦方向に並ぶ複数の基板載置部と、前記搬送領域に設けられる第1基板搬送機構と、第1基板載置部と、複数の基板載置部に含まれると共に処理ブロックに対して基板を受け渡すための第2基板載置部との間で、基板を受け渡す第2基板搬送機構と、を備える装置を構成する。【選択図】図3
Author TSUCHIYAMA MASASHI
ENOKIDA SUGURU
WATANABE TAKASHI
IIDA NARIAKI
IDE KOSEI
Author_xml – fullname: TSUCHIYAMA MASASHI
– fullname: IDE KOSEI
– fullname: ENOKIDA SUGURU
– fullname: WATANABE TAKASHI
– fullname: IIDA NARIAKI
BookMark eNrjYmDJy89L5WSwCw51Cg4JcgxxVQgI8nd2DQ729HNXcAwIcASKhQYrOPq5KGBV4usa4uHvwsPAmpaYU5zKC6W5GZTcXEOcPXRTC_LjU4sLEpNT81JL4r0CjAyMjA1MTczMTR2NiVIEAAG_LNQ
ContentType Patent
DBID EVB
DatabaseName esp@cenet
DatabaseTitleList
Database_xml – sequence: 1
  dbid: EVB
  name: esp@cenet
  url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP
  sourceTypes: Open Access Repository
DeliveryMethod fulltext_linktorsrc
Discipline Medicine
Chemistry
Sciences
DocumentTitleAlternate 基板処理装置及び基板処理方法
ExternalDocumentID JP2023054675A
GroupedDBID EVB
ID FETCH-epo_espacenet_JP2023054675A3
IEDL.DBID EVB
IngestDate Fri Jul 19 12:45:37 EDT 2024
IsOpenAccess true
IsPeerReviewed false
IsScholarly false
Language English
Japanese
LinkModel DirectLink
MergedId FETCHMERGED-epo_espacenet_JP2023054675A3
Notes Application Number: JP20210163665
OpenAccessLink https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230414&DB=EPODOC&CC=JP&NR=2023054675A
ParticipantIDs epo_espacenet_JP2023054675A
PublicationCentury 2000
PublicationDate 20230414
PublicationDateYYYYMMDD 2023-04-14
PublicationDate_xml – month: 04
  year: 2023
  text: 20230414
  day: 14
PublicationDecade 2020
PublicationYear 2023
RelatedCompanies TOKYO ELECTRON LTD
RelatedCompanies_xml – name: TOKYO ELECTRON LTD
Score 3.5935073
Snippet To improve throughput in a substrate processing apparatus and to suppress the exclusive floor area thereof.SOLUTION: A substrate processing apparatus...
SourceID epo
SourceType Open Access Repository
SubjectTerms BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Title SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
URI https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230414&DB=EPODOC&locale=&CC=JP&NR=2023054675A
hasFullText 1
inHoldings 1
isFullTextHit
isPrint
link http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfR1dS8Mw8JhT1DedijqVItK3YkcT2z0U6ael0DbMTvY20qwDFbrhKv59L7XTPcjeklw4LoH7yF3uDuCuIIYQul5oJeobjVgzU-OmsDSuG3yAwpDyJpE2SR-iMYkndNKB93UuTFMn9KspjogcJZDf60ZeL_-cWH7zt3J1X7zi0uIxzG1fbV_H0sM5IKrv2gHL_MxTPc-OmZqOfmAUpQJ1dmAX7WhTskPw4sq0lOWmTgmPYI8huqo-hs4b78GBt2691oP9pI1447BlvtWJ9Hm4ssVxHihslHlSDqZPisOYg2vjZ8VJfeXfLUmQR5l_CrdhkHuRhoRMf489jdkG0cYZdKtFVZ6DIuYm2ikmJ6IgZCjKITVmlBMyN0udcIteQH8Losut0D4cypkMlwzIFXTrj8_yGrVuXdw0t_UNdSCAAA
link.rule.ids 230,309,783,888,25576,76876
linkProvider European Patent Office
linkToHtml http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfR1dS8NALMwpzjedijo_ikjfih29s91DkX7NWtf2mJ3sbVxvHaiwDVfx75urm-5B9nYkR8gd5OOSSwJwkxNDCF3PtQLtjUassalxU1ga1w3eRmVIeVVIGyd34YBEQzqswfuqFqbqE_pVNUdEiRIo72Wlr-d_QSy_-lu5uM1fETS772a2ry5fxzLC2Saq79oBS_3UUz3Pjpia9H9wFLUCdbZgG31sU4pD8OLKspT5uk3p7sMOQ3LT8gBqb7wJDW81eq0Ju_Ey443LpfAtDmXMw5UjjrNAYf3Uk3oweVAcxhyEDZ4VJ_GVf7fEQRam_hFcd4PMCzVkZPR77FHE1pg2jqE-nU2LE1DExEQ_xeRE5IR0RNGhxphyQiZmoRNu0VNobSB0thF7BY0wi3uj3mPy1II9iZGpkzY5h3r58VlcoAUu88vq5r4BoaaC8w
openUrl ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=SUBSTRATE+PROCESSING+APPARATUS+AND+SUBSTRATE+PROCESSING+METHOD&rft.inventor=TSUCHIYAMA+MASASHI&rft.inventor=IDE+KOSEI&rft.inventor=ENOKIDA+SUGURU&rft.inventor=WATANABE+TAKASHI&rft.inventor=IIDA+NARIAKI&rft.date=2023-04-14&rft.externalDBID=A&rft.externalDocID=JP2023054675A