POLISHING PAD

• Main Authors: TATENO TEPPEI, TAKAMIZAWA YAMATO, KAWAMURA YOSHIHIDE, OCHI KEISUKE, MATSUOKA RYUMA, KAWASAKI TETSUAKI, KURIHARA HIROSHI
• Format: Patent
• Language: English; Japanese
• Published: 05.04.2023
• Subjects: BASIC ELECTRIC ELEMENTS; DRESSING OR CONDITIONING OF ABRADING SURFACES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; PERFORMING OPERATIONS; POLISHING; SEMICONDUCTOR DEVICES; TRANSPORTING

To provide a polishing pad improved in level difference eliminating performance without greatly changing the composition/physical property of a polishing layer.SOLUTION: A polishing pad comprises a polishing layer having a polishing surface for polishing an object to be polished, and a cushion layer arranged at an opposite side to the polishing surface of the polishing layer. Regarding a storage elastic modulus E' when the whole polishing pad is subjected to a dynamic viscoelasticity test in a bending mode by frequency dispersion (25°C), a ratio (E'1000/E'10) of an E' value (E'1000) of 1000 rad/s to an E' value (E'10) of 10 rad/s is 1-2.SELECTED DRAWING: Figure 1 【課題】 研磨層の組成・物性等を大きく変えることなく、段差解消性能が向上する研磨パッドを提供することを目的とする。【解決手段】 被研磨物を研磨加工するための研磨面を有する研磨層と、前記研磨層の研磨面と反対側に配置されるクッション層と、を備える研磨パッドであって、前記研磨パッド全体を曲げモードで周波数分散（２５℃）による動的粘弾性試験を行った際の貯蔵弾性率Ｅ'について、１０００ｒａｄ／ｓのＥ'の値（Ｅ'１０００）と１０ｒａｄ／ｓのＥ'の値（Ｅ'１０）との比（Ｅ'１０００／Ｅ'１０）が１～２である、研磨パッド。【選択図】図１