LASER PROCESSING DEVICE

• Main Authors: HISHIDA MITSUKI, NARUMI KEIJI
• Format: Patent
• Language: English; Japanese
• Published: 01.02.2023
• Subjects: CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS; OPTICS; PERFORMING OPERATIONS; PHYSICS; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

To reduce a transmission loss in each laser beam in a laser processing device for transmitting laser beams with different wavelengths by an optical fiber.SOLUTION: A laser processing device 100 includes: first and second laser oscillators 1 and 2 for emitting first and second laser beams LB1 and LB2...