LASER PROCESSING DEVICE

• Main Authors: HISHIDA MITSUKI, NARUMI KEIJI
• Format: Patent
• Language: English; Japanese
• Published: 01.02.2023
• Subjects: CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS; OPTICS; PERFORMING OPERATIONS; PHYSICS; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

To reduce a transmission loss in each laser beam in a laser processing device for transmitting laser beams with different wavelengths by an optical fiber.SOLUTION: A laser processing device 100 includes: first and second laser oscillators 1 and 2 for emitting first and second laser beams LB1 and LB2 with different wavelengths; optical path changing means 30 for changing respective optical paths of the first and second laser beams LB1 and LB2 so that they travel in different directions; an optical fiber 60 for guiding the first and second laser beams LB1 and LB2; and a laser head 70 configured so as to condense the first and second laser beams LB1 and LB2 at a predetermined position of a workpiece 200. The optical path changing means 30 is configured so as to make the first laser beam LB1 incident on a second core 63 of the optical fiber 60, and make the second laser beam LB2 incident on a first core 61 of the optical fiber 60.SELECTED DRAWING: Figure 3 【課題】互いに波長の異なるレーザ光を光ファイバで伝送するレーザ加工装置において、それぞれのレーザ光の伝送損失を低減する。【解決手段】レーザ加工装置１００は、互いに波長の異なる第１及び第２レーザ光ＬＢ１，ＬＢ２を出射する第１及び第２レーザ発振器１，２と、互いに異なる方向に進むように第１及び第２レーザ光ＬＢ１，ＬＢ２のそれぞれの光路を変更する光路変更手段３０と、第１及び第２レーザ光ＬＢ１，ＬＢ２を導光する光ファイバ６０と、第１及び第２レーザ光ＬＢ１，ＬＢ２をワーク２００の所定の位置に集光するように構成されたレーザヘッド７０と、を備えている。光路変更手段３０は、第１レーザ光ＬＢ１を光ファイバ６０の第２コア６３に、第２レーザ光ＬＢ２を光ファイバ６０の第１コア６１にそれぞれ入射させるように構成されている。【選択図】図３