SEMICONDUCTOR MODULE, ELECTRICAL COMPONENT, AND CONNECTION STRUCTURE OF SEMICONDUCTOR MODULE AND ELECTRICAL COMPONENT

• Main Authors: SAMPEI HIROKAZU, DOI KOJI, ISHINO HIROSHI, KUMAGAI KATSUYA
• Format: Patent
• Language: English; Japanese
• Published: 11.01.2023
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

To provide a semiconductor module capable of reducing inductance while facilitating insulation, an electrical component, and a connection structure between the semiconductor module and the electrical component.SOLUTION: Provided are a resin mold portion 19, a first terminal 15, and a second terminal 16. In the resin mold portion 19, a semiconductor chip 10 is resin-encapsulated. The first terminal 15 and the second terminal 16 are exposed from the resin mold portion 19. The first terminal 15 and the second terminal 16 are each plate-shaped and laminated to each other. The second terminal 16 protrudes outside the resin mold portion 19. The first terminal 15 is exposed to a surface different from a surface where the second terminal 16 of the resin mold portion 19 protrudes.SELECTED DRAWING: Figure 2 【課題】インダクタンスを低減しつつ容易に絶縁を確保することができる半導体モジュール、電気部品、および半導体モジュールと電気部品との接続構造を提供する。【解決手段】半導体チップ１０を樹脂封止した樹脂モールド部１９と、樹脂モールド部１９から露出した第１端子１５および第２端子１６と、を備え、第１端子１５および第２端子１６は、それぞれ板状とされ、互いに積層されており、第２端子１６は、樹脂モールド部１９の外部に突出しており、第１端子１５は、樹脂モールド部１９のうち第２端子１６が突出した面とは異なる面に露出している。【選択図】図２